昨天有朋友找我幫忙翻譯一下文件，紀錄一下好了
Holt is aware that during normal assembly, packages may demonstrate evidence of
delamination, which is why all device package families are MSL characterized, qualified and
monitored on an on‐going basis per our Quality Management System.
Holt 知道在正常的組裝中，封裝是有剝離的可能，
這就是為何我們的品質管理系統會去針對所有裝置去進行持續監測封裝的品質與MSL特性等等
Scanning acoustic microscopy probes with ultrasound pulses at various frequencies. At
interfaces between materials having different acoustic impedances, an acoustic reflection
(an echo) occurs. The intensity and polarity of this echo is recorded and presented as a color
map of the sample. This CSAM map may reveal delamination in the package but, depending
on the type, may not be a failure.
掃描聲波顯微鏡，透過發射各種不同的頻率聲波，去偵測不同界面的音波反射，因為不同材料會有不同的音波阻抗特性，
我們可以透過分析這個回聲的密度與極性，得到一個彩色的CSAM圖(Confocal Scanning Acoustic Microscopy)，
這個可以用來偵測封裝剝離的狀況，但是根據不同的狀況，這不見得就有問題的封裝
From J‐STD‐020E 6.2 Criteria Requiring Further Evaluation:
Delamination is not necessarily a cause for rejection. To evaluate the impact of
delamination on device reliability, the semiconductor manufacturer may either meet the
delamination requirements shown in 6.2.1 or perform reliability assessment using JESD22‐
A113 and JESD47 or the semiconductor manufacturer’s in‐house procedures. The reliability
assessment may consist of stress testing, historical generic data analysis, etc. If the SMD
Packages pass electrical tests and there is delamination on the back side of the die paddle,
heat spreader, or die back side (lead on chip only), but there is no evidence of cracking or
other delamination and they still meet specified dimensional criteria, the SMD Packages are
considered to pass that level of moisture sensitivity.
關於 J-STD-020E 6.2 需要進一步評估的標準
發生剝離現象不一定是需要被拒絕的，要評估剝離對裝置的可靠度，半導體製造商可以選擇滿足6.2.1中所示的剝離要求，
或者使用JESD22‐A113和JESD47進行可靠性評估，或者使用半導體製造商的內部程序。
可靠性評估可能包括應力測試、歷史通用數據分析等。如果SMD封裝通過了電性測試，
並且在晶片座的背面、散熱片或晶片背面（僅在晶片上的引腳）上有剝離，
但沒有裂紋或其他剝離的證據，並且仍符合指定的剝離尺寸標準，
那麼這些SMD封裝被認為通過了該潮濕敏感(MSL)等級。
The package families are fully qualified and subjected to stress tests per its MSL
classification. Parts are also monitored on a quarterly basis by re‐subjecting various parts
from a package family to their original qualification stress tests and ensuring they pass as
seen in the provided quarterly reliability report.
封裝系列已經是具有可靠品質，並根據其MSL分類通過了應力測試。
元件也每季度通過將封裝系列中的各種部件重新置於原始質量認證應力測試中進行監控，
並確保它們通過，如所提供的季度可靠性報告所示。
Holt stands by their parts and can report that they have shipped over 1,000,000 parts from
this package family over the past 10 years with zero returns for any problems with
delamination on the lead fingers.
Holt 堅持自己的產品，並且在過去的10年中，已經出貨了超過1,000,000個元件，沒有任何一個因為引腳剝離的緣故造成退貨。
其中就是CSAM 我不熟悉 查了一下其實就是Confocal Scanning Acoustic Microscopy 縮寫，簡單講就是利用不同頻率的超音波去檢測IC封裝內的狀況，因為不同材料本身對於頻率的阻抗不同，譬如剝離會產生不同的界面，透過偵測不同頻率與相位反射的情況，可以作圖產生一個IC封裝內部材料的組合情況，當本來黏合的不同部份產生剝離現象可以偵測出來，但是X-Ray 很難看到這個狀況。
願~~ 